Guangzhou YueXin Semiconductor Project: JB Spring Vibration Isolator Contract

As indicated on the official website of Shanghai Songjiang Shock Absorber Group Co., Ltd which specializes in manufacturing single rubber expansion joints and spring vibration isolators., we present the contract details for JB spring vibration isolators within the Guangzhou YueXin Semiconductor Project. Shanghai Songjiang Group offers noise reduction solutions and high-quality spring vibration isolators, along with single rubber expansion joints, catering to the air conditioning systems of various domestic semiconductor projects.

Introduction to the Guangzhou YueXin Semiconductor Project: The YueXin 12-inch wafer project is situated in the Huangpu District of the Guangzhou Development Zone. Representing an overall investment of 28.8 billion yuan, it stands as the sole 12-inch chip production line in both Guangzhou and Guangdong Province.

YueXin Semiconductor holds the distinction of being a pivotal construction endeavor in Guangdong Province and Guangzhou City. With a total investment of 28.8 billion yuan, the project is divided into two construction phases. The initial phase, backed by a 10 billion yuan investment, centers on the manufacturing of 0.18um-90nm analog chips and discrete devices. This phase aims to achieve a monthly production capacity of 40,000 12-inch wafers. The subsequent phase, supported by an 18.8 billion yuan investment, focuses on cutting-edge 65nm-40nm high-voltage BCD analog chip technology, projecting a monthly production capacity of 40,000 12-inch wafers.

According to Li Haiming, Vice President of YueXin Semiconductor Technology Co., Ltd., 12-inch wafers presently stand as the primary technological product of multinational corporations. Chinese manufacturers predominantly produce 6-inch and 8-inch wafers, and the self-sufficiency rate of 12-inch wafers remains relatively low. Larger wafer sizes permit greater chip production on a single wafer, substantially lowering production costs while necessitating advanced material and production technology. In comparison to an 8-inch wafer production line, YueXin’s 12-inch wafer production line is 2.25 times more efficient.

The operational focus of the project centers on segmentation, differentiation, and customization. It prioritizes high-end analog chips, automotive electronics, biomedicine testing, 5G front-end modules, and other domestically scarce products. The project is anticipated to achieve billion-yuan sales, further propelling the formation of a trillion-yuan output value for upstream and downstream enterprises.

On the day of the YueXin 12-inch wafer project’s commencement, YueXin Semiconductor inked agreements with over 20 semiconductor industry-academia-research units. This collaborative effort involves esteemed institutions like the Chinese Academy of Sciences Microelectronics Institute, Zhongshan University Microelectronics Institute, South China University of Technology Microelectronics Institute, Fudan University Microelectronics Institute, Guangzhou Angbao Electronics Co., Ltd., and Geko Microelectronics (Shanghai) Co., Ltd. This collaboration aims to collectively nurture talents for the advancement of the semiconductor industry.

By 2022, Huangpu aims to establish itself as a national integrated circuit industry cluster area. At the close of 2018, the “Several Measures to Accelerate the Development of the Integrated Circuit Industry in Guangzhou” outlined a plan for Guangzhou, centered around Huangpu District and Guangzhou Development Zone. The objective encompasses implementing seven major projects covering diverse aspects of the integrated circuit industry. The goal is to transform the area into a national integrated circuit industry cluster, a hub for talent, and a pioneering demonstration zone by 2022.

YueXin’s 12-inch wafer project spearheads the Virtual IDM (Virtual Integrated Device Manufacturer) operational model in China. According to the introduction, YueXin Semiconductor assumes the responsibility of constructing and operating the 12-inch wafer fab. It collaborates with chip design clients to custom develop the process platform, seamlessly intertwining “chip design,” “manufacturing,” and “customer market application demand.”

It is noteworthy that since the commencement of YueXin Semiconductor’s construction, 80 integrated circuit enterprise chain companies have visited the site. Among them, 32 companies have registered and established their presence, including over 7 enterprises with annual turnovers surpassing 100 million yuan. These projects span various fields, encompassing design, packaging and testing, equipment, and materials, thus constructing a comprehensive industrial chain ecosystem with YueXin Semiconductor at the helm. This integration covers “chip design – wafer manufacturing – packaging and testing – terminal application.”

As semiconductor companies continue to congregate, Huangpu has devised the New Energy and New Materials Value Innovation Park within the knowledge city where YueXin’s project is situated. Encompassing an area of 6.4 square kilometers, this park features the Integrated Circuit Industry Innovation Park as a notable component. The emphasis is on core enterprises like YueXin, introducing a slew of large-size wafer production line projects. The park aspires to make substantial strides in compound semiconductor devices, micro-electro-mechanical systems, power semiconductor devices, special processes, and third-generation semiconductor materials. The objective is to comprehensively enter the domains of computing, storage, and mobile communication chips. The plan involves the introduction of renowned domestic and foreign enterprises in the new materials sector, thereby forming a relatively comprehensive industrial chain and fostering the creation of the Guangzhou Intelligent Manufacturing Park.”

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